The **ATS-16F-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of electronic components like CPUs, GPUs, and high-power ICs. --- ## Technical Specifications The following table summarizes the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-16F-03-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 40.00mm x 40.00mm | | **Height** | 15.00mm | | **Fin Style** | Fine-Pitch (Straight Fins) | | **Thermal Resistance** | 15.85 °C/W (Unducted @ 100 LFM) | --- ## Key Features ### 1. Attachment Mechanism (pushPIN™) This heat sink utilizes a **pushPIN™** system, which uses a flexible attachment kit. It consists of a pin and a spring that provides a specific amount of pressure (preload) onto the component to ensure optimal thermal contact without damaging the PCB. ### 2. Thermal Performance * **Low Profile:** At only 15mm tall, it is suitable for space-constrained applications. * **High Efficiency:** The fine-pitch fin design maximizes surface area for air interaction, improving heat dissipation in forced convection environments. ### 3. Material and Coating * **AL6063 Aluminum:** Provides a good balance between weight, thermal conductivity, and cost. * **Blue Anodized Finish:** Not only provides an aesthetic look but also offers increased corrosion resistance and slightly improved emissivity for radiation cooling. --- ## Component Layout (Dimensions) For integration into a PCB design, the following dimensions are critical: ```text Width (A): 40.00 mm Length (B): 40.00 mm Height (C): 15.00 mm Pitch (E): 33.00 mm (Distance between pins) Pitch (F): 33.00 mm (Distance between pins) ``` --- ## Typical Applications * **Embedded Systems:** Cooling for ARM-based processors. * **Networking Hardware:** Heat management for switches and routers. * **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators.