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  • ATS-16D-80-C2-R0

  • AI
    The **ATS-16D-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-efficiency cooling of surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (with Spring) | | **Thermal Resistance** | 1.90°C/W (at 100 LFM) | | **Dimensions (L x W)** | 30.00mm x 30.00mm | | **Height (H)** | 25.00mm | | **Fin Style** | Straight Fin | --- ### 2. Key Design Features * **pushPIN™ Attachment:** This system uses a spring-loaded pin mechanism that provides a precise and secure fit to the PCB. It ensures constant pressure on the electronic component for optimal heat transfer. * **Material and Coating:** The use of aluminum provides a lightweight solution with high thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it improves surface emissivity and protects against corrosion. * **High Aspect Ratio Fins:** The "80" series design features vertical fins optimized for both natural and forced air convection. --- ### 3. Thermal Performance Data Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 1.90 | | 300 (1.5 m/s) | 1.25 | | 500 (2.5 m/s) | 1.05 | | 700 (3.5 m/s) | 0.95 | --- ### 4. Part Number Breakdown The nomenclature follows a specific logic: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **16D:** Series/Internal identifier. * **80:** Specific fin pattern/density. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment?
    • ⤷ How does this heat sink compare to the ATS-16D-81 series in terms of height?
    • ⤷ What type of thermal interface material (TIM) is recommended for this part?