The **ATS-16D-35-C2-R0** is a specific electronic component belonging to the **Heat Sink** category, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management system designed to provide high-performance cooling for electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Heat Sink Type** | Fine-Pitch (Straight Fin) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 22.48°C/W (Unducted Flow @ 100 LFM) | | **Spring Type** | ATS-PPS-16 (Steel) | --- ## 2. Key Component Parts The part number describes a system consisting of three primary electronic cooling sub-components: ### A. The Heat Sink (Thermal Dissipator) The core of the unit is a **35mm square aluminum block** with vertical fins. It is designed to maximize surface area to transfer heat from the silicon die to the surrounding air. The "C2" in the part number indicates a **Blue Anodized** finish, which protects against corrosion and slightly increases emissivity. ### B. The Push-Pin Attachment Instead of using messy thermal adhesives or complex screws, this part uses a **Plastic Push-Pin** mechanism. This allows for: * Consistent pressure across the component. * Easy installation and removal for board repairs. * Secure mounting in high-vibration environments. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically signifies that the unit comes with **Pre-applied Thermal Interface Material**. This is the layer that sits between the heat sink and the electronic chip to eliminate air gaps and ensure efficient heat transfer. --- ## 3. Thermal Performance Analysis The efficiency of the ATS-16D-35-C2-R0 depends heavily on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 22.48 | | **300 (1.5 m/s)** | 10.34 | | **500 (2.5 m/s)** | 7.22 | | **700 (3.5 m/s)** | 5.90 | --- ## 4. Part Number Breakdown `ATS - 16 D - 35 - C2 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **16:** Designates the specific spring type/attachment force. * **D:** Pin Fin / High-density fin configuration. * **35:** Width/Length in millimeters. * **C2:** Material finish (Blue Anodized). * **R0:** Thermal Interface Material / Revision code.