ATS-16D-29-C2-R0
AI

The **ATS-16D-29-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of electronic components like CPUs, GPUs, or power transistors.
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### Technical Specifications
| Feature | Details |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Number** | ATS-16D-29-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions** | 45.00mm x 45.00mm x 10.00mm |
| **Fin Type** | Straight Fin |
| **Thermal Resistance** | 7.57 °C/W (Unducted Flow @ 100 LFM) |
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### Key Electronic & Mechanical Components
#### 1. Heat Sink Body (Thermal Dissipator)
The body is constructed from **AL6063 aluminum**, chosen for its high thermal conductivity. The "Straight Fin" design allows air to pass through easily, transferring heat from the electronic component into the surrounding atmosphere via convection.
#### 2. pushPIN™ Attachment System
Instead of using messy adhesives or permanent solder, this part uses a mechanical tension system:
* **Brass/Plastic Pins:** Used to secure the heat sink to the PCB through pre-drilled holes.
* **Compression Springs:** These provide consistent pressure (force) against the electronic chip to ensure maximum surface contact.
#### 3. Thermal Interface Material (TIM)
The "R0" suffix indicates that the part typically comes with a **pre-applied thermal interface material**. This is a conductive pad or grease that fills microscopic air gaps between the chip and the heat sink to reduce thermal resistance.
#### 4. Blue Anodized Finish
This is not just for aesthetics. Anodizing increases the surface's emissivity and provides:
* Corrosion resistance.
* Electrical insulation (prevents short circuits if the sink accidentally touches exposed leads).
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### Thermal Performance Overview
| Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Unducted Flow (°C/W)** | 7.57 | 2.48 | 1.48 | 1.10 | 0.90 |
| **Ducted Flow (°C/W)** | 1.54 | 0.99 | 0.82 | 0.72 | 0.66 |
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- ⤷
What is the difference between ducted and unducted thermal resistance?
- ⤷ How do I determine if the 10mm height of this heat sink fits my enclosure?
- ⤷ What are the specific hole patterns required on a PCB for the pushPIN system?