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  • ATS-16D-29-C2-R0

  • AI
    The **ATS-16D-29-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of electronic components like CPUs, GPUs, or power transistors. --- ### Technical Specifications | Feature | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-16D-29-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 45.00mm x 45.00mm x 10.00mm | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 7.57 °C/W (Unducted Flow @ 100 LFM) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (Thermal Dissipator) The body is constructed from **AL6063 aluminum**, chosen for its high thermal conductivity. The "Straight Fin" design allows air to pass through easily, transferring heat from the electronic component into the surrounding atmosphere via convection. #### 2. pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical tension system: * **Brass/Plastic Pins:** Used to secure the heat sink to the PCB through pre-drilled holes. * **Compression Springs:** These provide consistent pressure (force) against the electronic chip to ensure maximum surface contact. #### 3. Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with a **pre-applied thermal interface material**. This is a conductive pad or grease that fills microscopic air gaps between the chip and the heat sink to reduce thermal resistance. #### 4. Blue Anodized Finish This is not just for aesthetics. Anodizing increases the surface's emissivity and provides: * Corrosion resistance. * Electrical insulation (prevents short circuits if the sink accidentally touches exposed leads). --- ### Thermal Performance Overview | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Unducted Flow (°C/W)** | 7.57 | 2.48 | 1.48 | 1.10 | 0.90 | | **Ducted Flow (°C/W)** | 1.54 | 0.99 | 0.82 | 0.72 | 0.66 | ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance?
    • ⤷ How do I determine if the 10mm height of this heat sink fits my enclosure?
    • ⤷ What are the specific hole patterns required on a PCB for the pushPIN system?