The **ATS-16D-22-C2-R0** is a specific electronic part number referring to a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their "blue ice" or high-density fin series, designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 13.87°C/W (at 1.0 m/s) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 12.70mm | | **Fin Style** | Straight Fin | | **Compliance** | RoHS / REACH | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to describe the physical and thermal properties: 1. **ATS-16**: Refers to the specific series/family (often high-density aluminum extrusions). 2. **D**: Refers to the specific footprint or base layout. 3. **22**: Internal manufacturer code for fin count and geometry. 4. **C2**: Indicates the **Blue Anodized** finish. 5. **R0**: Indicates the revision level and specific packaging/attachment configuration. --- ### 3. Key Electronic Cooling Features * **pushPIN™ Attachment:** This heat sink uses a spring-loaded mechanism that ensures a precise, secure, and repeatable attachment to the PCB. This prevents the heat sink from shifting during vibration or shipping. * **Optimal Airflow:** The straight fin design is optimized for environments where there is a clear direction of airflow, allowing for low pressure drop and high thermal dissipation. * **Pre-Applied Thermal Interface Material (TIM):** Most "R0" variants come with a high-performance thermal pad or grease pre-applied to the base, ensuring immediate installation and maximum heat transfer between the component and the aluminum. * **Blue Anodized Coating:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves heat radiation (emissivity). --- ### 4. Typical Applications * **Telecommunications:** Cooling of networking switches and routers. * **Computing:** Secondary cooling for chipsets or power management ICs. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.