ATS-16D-129-C2-R0
AI

### Overview of ATS-16D-129-C2-R0
The **ATS-16D-129-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is specifically designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits.
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### Technical Specifications
The following table outlines the mechanical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm |
| **Thermal Resistance** | 8.68°C/W (Unducted Flow @ 100 LFM) |
| **Pin Pitch** | 47.00mm (Square) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### Key Electronic & Cooling Features
#### 1. Low Profile Design
With a height of only **10.00mm**, this heat sink is designed for space-constrained electronic environments (such as 1U servers or thin-client devices) where vertical clearance is limited.
#### 2. pushPIN™ Attachment System
This part uses a specialized attachment mechanism that includes:
* **Compression Springs:** Provides precise pressure to ensure the heat sink makes firm contact with the electronic component.
* **Plastic/Brass Push Pins:** Designed for quick assembly to the PCB without the need for tools.
#### 3. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink, significantly reducing contact resistance.
#### 4. Fin Design
It utilizes a **cross-cut fin design**, which allows for airflow from any direction (multi-directional airflow). This is critical in electronics where the fan orientation might not be perfectly aligned with the heat sink.
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### Performance Data (Airflow)
| Velocity (LFM) | Velocity (m/s) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) |
| :--- | :--- | :--- | :--- |
| 100 | 0.5 | 8.68 °C/W | 1.59 °C/W |
| 300 | 1.5 | 3.11 °C/W | 1.07 °C/W |
| 500 | 2.5 | 2.25 °C/W | 0.89 °C/W |
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- ⤷
What is the significance of the 'Blue Anodized' finish in terms of thermal performance?
- ⤷ Can the pushPIN system be adjusted for different PCB thicknesses?
- ⤷ How does the 'Ducted' vs 'Unducted' airflow impact the cooling efficiency of this part?