công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-16D-129-C2-R0

  • AI
    ### Overview of ATS-16D-129-C2-R0 The **ATS-16D-129-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is specifically designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### Technical Specifications The following table outlines the mechanical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | | **Thermal Resistance** | 8.68°C/W (Unducted Flow @ 100 LFM) | | **Pin Pitch** | 47.00mm (Square) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### Key Electronic & Cooling Features #### 1. Low Profile Design With a height of only **10.00mm**, this heat sink is designed for space-constrained electronic environments (such as 1U servers or thin-client devices) where vertical clearance is limited. #### 2. pushPIN™ Attachment System This part uses a specialized attachment mechanism that includes: * **Compression Springs:** Provides precise pressure to ensure the heat sink makes firm contact with the electronic component. * **Plastic/Brass Push Pins:** Designed for quick assembly to the PCB without the need for tools. #### 3. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink, significantly reducing contact resistance. #### 4. Fin Design It utilizes a **cross-cut fin design**, which allows for airflow from any direction (multi-directional airflow). This is critical in electronics where the fan orientation might not be perfectly aligned with the heat sink. --- ### Performance Data (Airflow) | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 8.68 °C/W | 1.59 °C/W | | 300 | 1.5 | 3.11 °C/W | 1.07 °C/W | | 500 | 2.5 | 2.25 °C/W | 0.89 °C/W | ---
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'Blue Anodized' finish in terms of thermal performance?
    • ⤷ Can the pushPIN system be adjusted for different PCB thicknesses?
    • ⤷ How does the 'Ducted' vs 'Unducted' airflow impact the cooling efficiency of this part?