The **ATS-16D-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (Fin)** | 30.00 mm | | **Pitch** | Fine Pitch | | **Pattern** | Straight Fin | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | --- ### 2. Electronic/Mechanical Components The assembly consists of three primary elements: 1. **The Heat Sink Body:** A straight-fin aluminum block that increases the surface area for heat dissipation. 2. **Spring-Loaded pushPIN™:** The "16D" in the part number indicates the specific hardware used to mount the heat sink to the PCB. These provide consistent pressure to ensure the thermal interface material (TIM) performs correctly. 3. **Thermal Interface Material (TIM):** This part usually comes with **T766** pre-applied, which is a high-performance thermal grease used to eliminate air gaps between the component (CPU/GPU) and the heat sink. --- ### 3. Part Number Breakdown The nomenclature follows a specific logic: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **16:** Part of the pushPIN™ series hardware type. * **D:** Specific mounting/spring force profile. * **101:** Dimensional code for the length/width and fin configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision/Packaging status. --- ### 4. Application This component is typically used in the following electronic environments: * **Networking:** Cooling for high-speed routers and switches. * **Industrial PC:** Thermal management for embedded processors. * **Power Supplies:** Heat dissipation for MOSFETs or high-power transistors.