The **ATS-16B-89-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed by Advanced Thermal Solutions (ATS) for cooling integrated circuits (ICs) and other surface-mount components. ### 1. Key Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Part Number** | ATS-16B-89-C2-R0 | Manufacturer Series: pushPIN™ | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Enhances radiation heat transfer and prevents corrosion | | **Dimensions** | 35mm x 35mm x 30mm | Length x Width x Height | | **Thermal Resistance** | 7.94°C/W (@ 1.0 m/s) | Efficiency of heat dissipation under airflow | | **Attachment Type** | Push-Pin | Secure mechanical mounting | --- ### 2. Physical Design Features * **Fin Type (Straight Fin):** This model features a straight-fin pattern designed for **longitudinal flow**. This is ideal for systems where the airflow direction is consistent and predictable. * **Push-Pin Mounting:** Unlike adhesive tapes, push-pins provide a consistent pressure (specified by a spring) against the component. This ensures a reliable thermal interface over the product's lifetime. * **Interface Material:** The "C2" in the part number typically indicates that a **Thermal Interface Material (TIM)**—specifically T766—is pre-applied to the base to fill microscopic air gaps between the heatsink and the chip. --- ### 3. Application Use Cases This specific heatsink is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling networking processors and ASICs. 2. **Embedded Systems:** Industrial PCs or controllers that generate significant heat in a small footprint. 3. **Power Supplies:** Cooling MOSFETs or power regulators. --- ### 4. Thermal Performance Breakdown The effectiveness of the ATS-16B-89-C2-R0 is highly dependent on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): * **At 200 LFM (1.0 m/s):** Thermal Resistance is **7.94°C/W**. * **At 400 LFM (2.0 m/s):** Thermal Resistance drops to **3.52°C/W** (Significant improvement). * **At 600 LFM (3.0 m/s):** Thermal Resistance drops to **2.50°C/W**.