The **ATS-16B-87-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 13.12°C/W (at 100 LFM) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 12.70mm | | **Fin Style** | Straight (Spread Fin) | --- ## Key Components & Features ### 1. The Heat Sink Body The part is made from **extruded aluminum**. Aluminum is chosen for its excellent balance between thermal conductivity, weight, and cost. The blue anodized finish is not just for aesthetics; it provides surface protection and slightly increases emissivity for better radiation cooling. ### 2. The maxiFLOW™ Design The "maxiFLOW" geometry features a flared fin structure. This design increases the surface area while maintaining a low pressure drop. It is highly effective in environments where there is constrained airflow, as it maximizes the contact between the air and the metal. ### 3. pushPIN™ Attachment System Rather than using messy thermal adhesives or tapes, this part uses a mechanical **pushPIN™** system: * **Spring-loaded:** Ensures constant, high-pressure contact between the heat sink and the chip. * **Brass/Plastic Pins:** Provides a secure mechanical lock into pre-drilled holes on the PCB. * **Reliability:** It is designed to withstand high-vibration environments and is easily removable. ### 4. Thermal Interface Material (TIM) The part typically comes with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad. This fills the microscopic air gaps between the heat sink base and the electronic component to ensure maximum heat transfer. --- ## Typical Applications * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Networking Hardware:** Managing heat in high-speed routers and switches. * **Embedded Systems:** Industrial PCs where space is limited but heat density is high. ---