ATS-16B-83-C2-R0
AI

The **ATS-16B-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs).
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (with Springs) |
| **Thermal Resistance** | 1.60°C/W (at 100 LFM) |
| **Dimensions** | 30mm x 30mm x 30mm |
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### 2. Physical Design and Construction
The part is engineered for maximum heat dissipation within a compact footprint.
* **Fin Style:** It utilizes a **Cross-Cut** fin pattern. This design allows for airflow from multiple directions, making it more versatile in systems where air direction might fluctuate.
* **Material:** Made from **AL6063**, an aluminum alloy known for high thermal conductivity and structural integrity.
* **Finish:** The **Blue Anodized** coating is not just aesthetic; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer.
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### 3. Attachment Mechanism: Push Pins
One of the defining features of the `C2-R0` variant is the attachment system:
1. **Push Pin:** The part uses specialized pins (usually brass or plastic) that snap into pre-drilled holes on the Printed Circuit Board (PCB).
2. **Springs:** Compression springs (often stainless steel) provide precise and consistent pressure on the component (CPU/GPU/Chipset), ensuring an optimal thermal interface without cracking the die.
3. **TIM (Thermal Interface Material):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal phase-change material or grease.
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### 4. Part Number Decoder
Understanding the "ATS-16B-83-C2-R0" nomenclature:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Brand) |
| **16** | Series Type |
| **B** | Component attachment style |
| **83** | Specific dimensions/design iteration |
| **C2** | Color/Finish (Blue Anodized) |
| **R0** | RoHS Compliant / Revision code |
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### 5. Typical Applications
* **Embedded Systems:** Cooling high-speed processors in industrial PCs.
* **Telecommunications:** Managing heat in routers and switches.
* **Power Supplies:** Heat dissipation for MOSFETs or power regulators.
- ⤷What is the difference between push-pin and clip-on heat sink attachments?
- ⤷ How does 'LFM' affect the thermal resistance of this heat sink?
- ⤷ Can the pre-applied TIM be replaced with third-party thermal paste?