The **ATS-16B-72-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* (ATS). Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications This part is part of the **pushPIN™** series, designed for easy installation and high thermal efficiency on Printed Circuit Boards (PCBs). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-16B-72-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.11°C/W (at 100 LFM) | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the heat sink fits within the component "keep-out" zones on a PCB. * **Length (A):** 45.00 mm * **Width (B):** 45.00 mm * **Height (C):** 35.00 mm (High profile) * **Pitch (E):** 50.00 mm (Distance between attachment holes) * **Pitch (F):** 50.00 mm --- ### 3. Thermal Performance Data The efficiency of the heat sink depends on the airflow (measured in Linear Feet per Minute - LFM) provided by the system's cooling fans. | Airflow Velocity (LFM) | Thermal Resistance (Unducted) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 5.11 °C/W | 2.73 °C/W | | 200 (1.0 m/s) | 2.73 °C/W | 1.83 °C/W | | 400 (2.0 m/s) | 1.82 °C/W | 1.44 °C/W | | 600 (3.0 m/s) | 1.45 °C/W | 1.26 °C/W | --- ### 4. Technical Component Breakdown #### A. Fin Design (Straight Fin) The **72 series** typically utilizes a straight-fin pattern. This provides a large surface area for heat dissipation into the surrounding air. The aluminum construction ensures high thermal conductivity while remaining lightweight. #### B. Attachment Mechanism: pushPIN™ Instead of using messy adhesives or complicated screws, this part uses a **pushPIN™** system: * **Springs:** Pre-assembled with a fine-pitch spring to provide the exact pressure required for optimal thermal interface contact. * **Push Pins:** Available in plastic or brass to secure the sink through pre-drilled PCB holes. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of Thermal Interface Material used. * **T766:** This model typically comes pre-applied with a high-performance thermal phase-change material or grease to ensure no air gaps exist between the electronic component (CPU/GPU/FPGA) and the heat sink. --- ### 5. Part Number Nomenclature Breakdown `ATS - 16 - B - 72 - C2 - R0` * **ATS:** Advanced Thermal Solutions * **16:** Attachment / Series style * **B:** Revision * **72:** Fin geometry/dimensions code * **C2:** Thermal Interface Material (T766) / Performance Grade * **R0:** RoHS compliant (Lead-free) ---