The **ATS-16B-63-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 12.32°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions to identify the product's attributes: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **16B:** Indicates the specific series or attachment style. * **63:** Refers to the physical footprint/size. * **C2:** Designates the thermal performance/fin density category. * **R0:** Indicates the material and finish (Blue Anodized Aluminum). --- ### 3. Key Electronic Cooling Features #### A. Thermal Interface Material (TIM) The "R0" designation typically implies that the unit comes with a pre-applied thermal interface material (like a phase-change material or thermal pad). This ensures the most efficient heat transfer from the electronic chip to the aluminum fins. #### B. Push-Pin Attachment This part uses a **Brass Push-Pin** mechanism. This is critical for electronics assembly because: * It provides a consistent pressure (load) on the component. * It allows for secure mounting through pre-drilled holes in the PCB. * The compression springs ensure the heat sink stays in contact even during mechanical vibration. #### C. Airflow Efficiency The straight-fin design is optimized for **forced convection** cooling. It is intended to be placed in the path of a system fan. The blue anodized coating is not just for aesthetics; it increases surface emissivity and protects the aluminum from oxidation. --- ### 4. Typical Applications This component is used to cool integrated circuits (ICs) that generate moderate to high heat, including: * Networking switches and routers. * Industrial control systems. * High-speed logic gates and FPGAs. * Embedded computing boards.