The **ATS-16B-08-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions Inc.** It is designed for cooling electronic components such as CPUs, GPUs, and power modules within constrained spaces. --- ## 1. Technical Specifications Below is the technical breakdown of the part based on its nomenclature and physical design: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 14.21°C/W (@ 100 LFM) | | **Dimensions** | 45mm x 45mm | | **Height** | 15mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied Phase Change Material) | --- ## 2. Key Electronic & Mechanical Features ### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses the **pushPIN™ system**. * **Precision:** It uses a flexible, spring-loaded mechanism that ensures even pressure across the electronic component. * **Reliability:** It prevents the heat sink from shifting during mechanical shock or vibration, protecting the delicate silicon die. ### B. "C2" Material & Finish The **C2** designation refers to the specific material grade and finish: * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** This is not just aesthetic; anodizing increases the surface emissivity, allowing for better heat radiation and providing a protective layer against corrosion and electrical conductivity at the surface. ### C. Thermal Performance (LFM) Electronic heat sinks are rated by Airflow (Linear Feet per Minute). For the ATS-16B-08-C2-R0: * **Low Airflow (100 LFM):** 14.21°C/W resistance. * **High Airflow (700 LFM):** 1.90°C/W resistance. * *Interpretation:* As airflow increases, the efficiency of this part increases dramatically, making it ideal for forced-convection environments (server racks, high-speed networking gear). --- ## 3. Application Use-Cases This specific heat sink is commonly found in the following electronic assemblies: 1. **Network Switches/Routers:** Cooling ASICs that process high volumes of data. 2. **Power Supplies (PSU):** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Used on industrial PC boards where height (15mm) is restricted. --- ## 4. Cross-Reference/Ordering Code Breakdown ```text ATS - 16 B - 08 - C2 - R0 | | | | | | | | | +-- Revision Code | | | +------- Finish (Blue Anodized / T766 TIM) | | +------------ Height (15mm) | +----------------- Fin Pitch/Type (Fine Pitch) +----------------------- Advanced Thermal Solutions (Manufacturer) ```