The **ATS-16B-06-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications The part number encodes specific data about its dimensions and material properties: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | Push Pin (Spring-loaded) | | **Dimension (Length/Width)** | 45mm x 45mm | | **Height** | 25mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.03°C/W (at 200 LFM) | | **Attachment Method** | Plastic Push Pin / Brass Spring | --- ### 2. Physical Design Features The ATS-16B-06-C2-R0 utilizes a specific geometry to maximize thermal dissipation: * **Fin Style:** It features a **Straight Fin** pattern. This design is optimized for environments where there is a consistent, directional airflow (forced convection). * **Material Choice:** Aluminum is used for its excellent thermal conductivity-to-weight ratio. The blue anodized finish provides surface protection and increased emissivity. * **Mounting Mechanism:** The "Push Pin" system uses a spring-loaded mechanism that ensures consistent pressure between the heat sink and the component, which is critical for maximizing thermal transfer. --- ### 3. Thermal Performance Profile Thermal resistance measures how effectively the part moves heat away from the silicon. Lower values indicate better performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 m/s (200 LFM) | 2.03 | | 2.0 m/s (400 LFM) | 1.18 | | 3.0 m/s (600 LFM) | 0.82 | --- ### 4. Typical Applications This component is generally found in the following electronic assemblies: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** For industrial computers where airflow is managed. * **Power Supplies:** Cooling voltage regulators or MOSFETs. --- ### 5. CAD / Footprint Information If you are designing a PCB for this part, note the hole pattern required: ```markdown Hole Diameter: 3.0mm Hole Pitch (Distance): 38mm (diagonal or square depending on board layout) ```