The **ATS-16B-01-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. Technical Specifications This part is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors on a PCB. | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Heat Sink Type** | Push-pin Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with springs) | | **Thermal Resistance (Unducted)** | 18.51 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.62 °C/W @ 100 LFM | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and ensuring no interference with nearby electronic parts. | Dimension | Value (mm) | | :--- | :--- | | **Length/Width** | 40.00 mm x 40.00 mm | | **Height** | 10.00 mm | | **Hole Spacing** | 33.00 mm | | **Push-Pin Material** | Brass / Plastic | --- ### 3. Key Electronic Cooling Features * **Fin Configuration:** It utilizes a **Square Fin** pattern (XC-Cut), which allows for multi-directional airflow. This is ideal for electronic enclosures where airflow direction may vary. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease used to bridge the microscopic air gaps between the component (chip) and the heat sink. * **Push-Pin Mounting:** The use of push-pins ensures consistent pressure (clamping force) against the electronic component, which is vital for maintaining low thermal resistance over time. --- ### 4. Typical Applications The ATS-16B-01-C2-R0 is commonly found in: 1. **Telecommunications:** Cooling signal processing chips. 2. **Embedded Systems:** For low-profile industrial computers. 3. **Power Electronics:** Managing heat for voltage regulators or MOSFET arrays.