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  • ATS-15F-96-C2-R0

  • AI
    The **ATS-15F-96-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This specific part is designed for cooling electronic components, primarily BGA (Ball Grid Array) packages, CPUs, or GPUs that require efficient thermal management. ### Technical Specifications The following table outlines the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15F-96-C2-R0 | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 35.00mm | | **Fin Style** | Straight Fin (push-pin mount) | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | ~1.40°C/W (varies by airflow) | | **Finish** | Blue Anodized | --- ### Component Breakdown #### 1. Heat Sink Design (Straight Fin) The "Straight Fin" geometry is optimized for **forced air convection**. Unlike cross-cut designs, straight fins allow air to flow through the channels with minimal resistance, making it ideal for systems with directed fans or cooling ducts. #### 2. Attachment System (Push-Pin) This part utilizes a **push-pin and spring mechanism**. * **Ease of Installation:** It allows for quick assembly and consistent pressure. * **Thermal Interface:** The pressure from the springs ensures that the Thermal Interface Material (TIM) makes perfect contact between the component and the heat sink base. #### 3. Material and Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodizing:** Besides aesthetics, the anodized coating provides corrosion resistance and increases surface emissivity, slightly improving heat radiation. #### 4. Thermal Interface Material (TIM) Typically, the "R0" suffix indicates that the part comes pre-applied with high-performance thermal tape or a phase-change material, which simplifies the manufacturing process by removing the need for external thermal paste. --- ### Performance Context This heat sink is categorized under the **pushPIN™** series. The efficiency of the ATS-15F-96-C2-R0 is highly dependent on the velocity of the air (measured in Linear Feet per Minute or LFM). At higher LFM, the thermal resistance drops significantly, allowing the component to run cooler under heavy processing loads.
    ✨ Follow-up Questions
    • ⤷ How does the thermal resistance of this heat sink change at different airflow speeds (LFM)?
    • ⤷ What is the specific spring type and material used in the push-pin assembly for this model?
    • ⤷ What are the compatible PCB hole patterns for mounting the ATS-15F-96-C2-R0?