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  • ATS-15F-90-C2-R0

  • AI
    The **ATS-15F-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling processors and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Brass, 10-Step) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Component Analysis ### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **straight-fin design** is optimized for high-velocity airflow environments (active cooling), allowing air to flow through the channels with minimal resistance. ### B. The Attachment Mechanism (Push-Pin) This part uses a **Push-Pin and Spring** assembly. * **Purpose:** It ensures a constant, secure pressure between the heat sink and the electronic component (CPU/GPU). * **Reliability:** The 10-step brass push-pin provides a more secure mechanical attachment than adhesive tapes, which can fail under high heat or vibration. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific thermal interface material. * **T766:** This is a high-performance phase-change material applied to the base. It fills microscopic gaps between the heat sink and the chip to maximize heat transfer efficiency. --- ## 3. Performance Data Thermal resistance is measured based on the airflow (Linear Feet per Minute - LFM): | Air Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM** | 6.36 | | **400 LFM** | 3.33 | | **600 LFM** | 2.50 | | **800 LFM** | 2.10 | --- ## 4. Part Number Breakdown The nomenclature for this part follows the ATS standard: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **15F:** Series/Family code * **90:** Specific dimension/fin configuration * **C2:** Thermal Interface Material (T766) * **R0:** Revision/Standard packaging
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole requirements for the push-pins on this heat sink?
    • ⤷ Can this heat sink be used in a passive cooling environment without fans?
    • ⤷ How does the T766 TIM compare to standard thermal grease in terms of longevity?