## Technical Overview: ATS-15F-85-C2-R0 The **ATS-15F-85-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** product line, specifically designed to optimize airflow and thermal dissipation for electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-15F-85-C2-R0 | | **Base Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 4.55°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | Tapered Fin (maxiFLOW™) | --- ### 2. Component Analysis #### A. The maxiFLOW™ Design The "85" series features a unique **tapered fin design**. Unlike standard straight-fin heat sinks, the tapered geometry maximizes the surface area for radiant heat transfer while minimizing the pressure drop. This allows air to flow more freely through the fins, making it highly efficient in environments with restricted airflow. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism: * **Spring-loaded bolts:** Ensures consistent pressure (clamping force) across the thermal interface material (TIM). * **Ease of Assembly:** It can be quickly installed into pre-drilled holes on the PCB. * **Vibration Resistance:** The spring tension prevents the heat sink from shifting or losing contact during mechanical shock. #### C. Thermal Interface Material (TIM) The **"C2"** in the part number indicates the type of thermal interface material pre-applied to the base. In this specific configuration, it typically refers to **ATS-PPS-02**, a high-performance phase-change or grease-like material designed to fill microscopic air gaps between the chip and the heat sink. --- ### 3. Applications * **Telecommunications:** Cooling of networking switches and routers. * **Industrial PCs:** Heat management in compact embedded systems. * **Power Electronics:** Dissipating heat from high-speed transistors and voltage regulators. --- ### 4. Thermal Performance Data *Measured in °C/W (Lower is better)* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 4.55 | | 400 (2.0 m/s) | 2.50 | | 600 (3.0 m/s) | 1.80 |