ATS-15F-84-C2-R0
AI

### Technical Overview: ATS-15F-84-C2-R0
The **ATS-15F-84-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power integrated circuits.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (with Blue Anodized Finish) |
| **Attachment Method** | Push Pin (Plastic/Brass) |
| **Heat Sink Type** | Straight Fin |
| **Dimensions** | 30.00mm x 30.00mm x 25.00mm |
| **Thermal Resistance** | 6.74°C/W (at 200 LFM) |
| **Compatibility** | Pre-drilled for 38mm hole spacing |
| **Thermal Interface** | Pre-applied T766 Phase Change Material |
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### 2. Functional Components
#### A. The Fin Geometry
The device uses a **Straight Fin** design. This allows for excellent airflow in a single direction, making it ideal for systems with high-velocity internal fans. The 25mm height provides a significant surface area for heat dissipation relative to its small 30x30mm footprint.
#### B. Attachment Mechanism (Push Pins)
Instead of adhesive tapes, this model uses a mechanical **Push Pin** system with a compression spring.
* **Benefits:** Ensures consistent pressure on the component, improving thermal contact.
* **Reliability:** Unlike tape, mechanical fasteners do not degrade over time due to heat cycles.
#### C. Thermal Interface Material (TIM)
The base comes pre-coated with **T766**. This is a "Phase Change" material that softens when the component heats up, filling microscopic air gaps between the chip and the aluminum for maximum heat transfer.
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### 3. Performance Metrics
Thermal performance varies based on the Airflow (Linear Feet per Minute - LFM).
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 (Static)** | 9.00 |
| **200** | 6.74 |
| **400** | 5.24 |
| **600** | 4.60 |
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### 4. Summary for Engineers
The "84" in the part number indicates the specific fin density and height configuration, while the "C2" suffix typically denotes the **Blue Anodized** finish, which provides corrosion resistance and increased emissivity for radiative cooling.
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What are the specific PCB hole requirements for mounting this heat sink?
- ⤷ How does the T766 phase change material compare to standard thermal grease?
- ⤷ Are there alternative fin designs for this footprint that work better in low-airflow environments?