The **ATS-15F-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in restricted airflow environments. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 45.00mm x 40.00mm x 10.00mm | | **Thermal Resistance** | 14.95°C/W (Unducted Flow @ 200 LFM) | | **Compliance** | RoHS Compliant | --- ## 2. Key Design Features ### A. maxiFLOW™ Geometry The "F" in the part number denotes the **maxiFLOW™** design. Unlike standard rectangular fin heat sinks, this design features a tapered fin structure. - **Benefit:** It increases the surface area while reducing pressure drop, making it highly efficient for convection cooling. ### B. pushPIN™ Attachment System The part utilizes the ATS **pushPIN™** system for mounting. - **Hardware:** It includes a flexible spring-loaded pin mechanism. - **Installation:** This allows for secure, vibration-resistant attachment to the PCB without requiring complex tools or adhesives. ### C. Material and Coating - **Aluminum:** Provides a lightweight solution with high thermal conductivity. - **Blue Anodized Finish:** Protects the aluminum from corrosion and slightly improves radiant heat transfer. --- ## 3. Part Number Breakdown The nomenclature for ATS heat sinks provides specific details about the component: | Segment | Meaning | | :--- | :--- | | **ATS-15** | Series and Mounting Style (pushPIN™) | | **F** | Fin Style (maxiFLOW™) | | **75** | Specific footprint/dimension code | | **C1** | Thermal Interface Material (TIM) type (e.g., Phase Change) | | **R0** | Revision/Packaging code | --- ## 4. Typical Applications This heat sink is commonly used to cool integrated circuits (ICs) that generate significant heat in compact spaces, such as: * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.