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  • ATS-15F-40-C2-R0

  • AI
    ## Technical Specifications: ATS-15F-40-C2-R0 The **ATS-15F-40-C2-R0** is a high-performance **push-pin heat sink** designed by Advanced Thermal Solutions (ATS). It is specifically engineered for cooling electronic components such as CPUs, GPUs, and high-power chipsets. --- ### 1. Key Physical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Footprint / Size** | 45mm x 45mm | | **Height** | 15mm | | **Attachment Type** | Push-Pin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Thermal Performance Data The efficiency of this heat sink depends on the airflow (measured in Linear Feet per Minute - LFM) within the electronic enclosure. | Airflow (LFM) | Thermal Resistance (°C/W - Unducted) | | :--- | :--- | | **200 LFM** | 14.56 | | **400 LFM** | 9.32 | | **600 LFM** | 7.72 | | **800 LFM** | 6.89 | --- ### 3. Electronic Design Considerations When integrating the ATS-15F-40-C2-R0 into a PCB design, several electronic and mechanical factors must be considered: * **Attachment Mechanism:** It uses a push-pin and brass spring system. The spring provides a precise amount of downward pressure (calculated to optimize thermal contact without damaging the silicon die). * **Thermal Interface Material (TIM):** The pre-applied T766 is a high-performance phase-change material. It minimizes the air gaps between the component surface and the heat sink base, reducing contact resistance. * **Fin Geometry:** The part uses a **Straight Fin** design. This is ideal for systems with clear, directed airflow, allowing for low pressure drops across the heatsink. * **Electromagnetic Interference (EMI):** While the aluminum itself is conductive, the blue anodized finish provides a thin layer of insulation. However, for grounding purposes, the mechanical attachment to the PCB usually relies on the specific push-pin holes. --- ### 4. Compatibility and Sizing To ensure this part fits your electronic board, verify the hole patterns: * **Pitch:** The distance between mounting holes must match the specific push-pin layout of the ATS-15F series. * **Vertical Clearance:** At 15mm height, it is suitable for 1U or 2U rack-mount chassis depending on the internal layout.
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole diameters required for the push-pins?
    • ⤷ Does this heat sink come in different finishes for specific EMI requirements?
    • ⤷ How does the T766 TIM perform compared to standard thermal grease?