The **ATS-15F-36-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their **maxiFLOW™** series, designed for high-density electronic cooling. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Series** | maxiFLOW™ | | **Base Dimensions** | 36.83mm x 36.83mm | | **Height** | 14.50mm | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 2.72°C/W (@ 200 LFM) | | **Shape** | Square | --- ### 2. Design and Engineering Features The ATS-15F-36-C2-R0 is engineered with specific geometries to maximize heat dissipation in constrained spaces: * **Spread Fin Pattern:** The "maxiFLOW" design uses a flared fin pattern. Unlike traditional straight fins, these increase the surface area and provide better airflow intake, significantly reducing the thermal resistance from the component to the ambient air. * **pushPIN™ Attachment:** This model uses a spring-loaded attachment system. This ensures even pressure across the processor or component, preventing damage while providing optimal thermal contact. * **Thermal Interface Material (TIM):** Typically, this part comes pre-applied with **T766** phase-change material or a similar high-performance thermal pad, which eliminates the need for manual paste application. * **Material properties:** Made from extruded aluminum with a black anodized finish, which not only protects against corrosion but also enhances radiant heat transfer. --- ### 3. Common Applications This heat sink is intended for medium-to-high power electronic components that generate significant heat during operation, including: 1. **Processors (CPUs/GPUs):** Used in embedded systems and industrial PCs. 2. **FPGAs & ASICs:** Ideal for telecommunications equipment and data routing hardware. 3. **Power Electronics:** Cooling for high-efficiency voltage regulators and power modules. 4. **LED Drivers:** Used in high-lumen industrial lighting setups. --- ### 4. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how effectively the sink removes heat. As airflow (measured in Linear Feet per Minute - LFM) increases, the resistance drops: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 2.72 | | 400 | 2.0 | 1.56 | | 600 | 3.0 | 1.20 | ---