ATS-15F-33-C2-R0
AI

The **ATS-15F-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and FPGAs.
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### ## Technical Specifications
The following table outlines the key physical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum (Anodized Blue) |
| **Thermal Resistance** | 3.52°C/W @ 200 LFM |
| **Attachment Method** | pushPIN™ (Brass/Plastic pins) |
| **Dimensions (L x W)** | 36.83 mm x 36.83 mm |
| **Height** | 17.78 mm |
| **Compliance** | RoHS Compliant |
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### ## Key Electronic Features
1. **maxiFLOW™ Fin Geometry:**
The part features a unique spread-fin design that reduces pressure drop and maximizes surface area. In electronics, this allows for efficient cooling even in environments with low-velocity airflow.
2. **pushPIN™ Attachment:**
This specific model utilizes the `pushPIN™` mechanism. This is critical for PCB (Printed Circuit Board) assembly as it provides:
* **Consistent Pressure:** Ensures the thermal interface material (TIM) is evenly compressed between the chip and the heat sink.
* **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping.
3. **Thermal Interface Material (TIM):**
The `-R0` suffix typically indicates that the part comes with **T766** pre-applied thermal phase-change material, which improves heat transfer from the electronic component to the aluminum fins.
4. **Hardware & Springs:**
It is equipped with a stainless steel spring to provide precise vertical force, ensuring the electronic package is not damaged while maintaining optimal contact.
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### ## Applications in Electronics
This heat sink is commonly used in:
* **Networking Gear:** Routers and switches where airflow is directed.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Cooling MOSFETs or power regulators.
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- ⤷
What is the difference between the pushPIN and clip-on attachment methods for this series?
- ⤷ How does the LFM (Linear Feet per Minute) affect the thermal resistance of the ATS-15F-33-C2-R0?
- ⤷ Is this heat sink compatible with standard BGA components?