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  • ATS-15F-33-C2-R0

  • AI
    The **ATS-15F-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from high-power electronic components like CPUs, GPUs, and FPGAs. --- ### ## Technical Specifications The following table outlines the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 3.52°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Dimensions (L x W)** | 36.83 mm x 36.83 mm | | **Height** | 17.78 mm | | **Compliance** | RoHS Compliant | --- ### ## Key Electronic Features 1. **maxiFLOW™ Fin Geometry:** The part features a unique spread-fin design that reduces pressure drop and maximizes surface area. In electronics, this allows for efficient cooling even in environments with low-velocity airflow. 2. **pushPIN™ Attachment:** This specific model utilizes the `pushPIN™` mechanism. This is critical for PCB (Printed Circuit Board) assembly as it provides: * **Consistent Pressure:** Ensures the thermal interface material (TIM) is evenly compressed between the chip and the heat sink. * **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping. 3. **Thermal Interface Material (TIM):** The `-R0` suffix typically indicates that the part comes with **T766** pre-applied thermal phase-change material, which improves heat transfer from the electronic component to the aluminum fins. 4. **Hardware & Springs:** It is equipped with a stainless steel spring to provide precise vertical force, ensuring the electronic package is not damaged while maintaining optimal contact. --- ### ## Applications in Electronics This heat sink is commonly used in: * **Networking Gear:** Routers and switches where airflow is directed. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power regulators. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between the pushPIN and clip-on attachment methods for this series?
    • ⤷ How does the LFM (Linear Feet per Minute) affect the thermal resistance of the ATS-15F-33-C2-R0?
    • ⤷ Is this heat sink compatible with standard BGA components?