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  • ATS-15F-18-C2-R0

  • AI
    The **ATS-15F-18-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "blue ice" series, designed primarily for cooling integrated circuits (ICs), BGAs, and other surface-mount components. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 13.38°C/W (at 100 LFM) | | **Dimensions (L x W)** | 54mm x 54mm | | **Height (Fin Height)** | 15mm | | **Fin Pitch/Type** | Fine Pitch / Straight Fin | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by ATS to identify the product's physical and thermal characteristics: * **ATS-15**: Indicates the specific series and size profile. * **F**: Represents the Fin Pitch (Fine Pitch). * **18**: Designates the specific fin pattern or height variation. * **C2**: Refers to the material and finish (usually T766 finish or specific thermal interface material). * **R0**: Indicates the revision number or packaging type. --- ### 3. Key Electronic Functions Electronic parts like the ATS-15F-18-C2-R0 are "passive" components. Their primary roles in a circuit are: 1. **Thermal Management**: It dissipates heat generated by high-performance chips (CPUs, GPUs, FPGAs) to prevent thermal throttling or hardware failure. 2. **Increased Surface Area**: The "Straight Fin" design increases the area exposed to the air, allowing for better heat exchange via convection. 3. **Mechanical Stability**: The push-pin attachment mechanism ensures a constant pressure is applied to the thermal interface material (TIM), ensuring maximum heat transfer efficiency. --- ### 4. Component Comparison: Active vs. Passive Cooling | Feature | ATS-15F-18-C2-R0 (Passive) | Active Cooling (Fan/Sink Combo) | | :--- | :--- | :--- | | **Power Consumption** | 0W (No power needed) | 1W - 5W (Fan motor) | | **Noise Level** | Silent | Audible (Fan noise) | | **Reliability** | High (No moving parts) | Moderate (Fan can fail) | | **Ideal Environment** | High-airflow chassis | Low-airflow or enclosed spaces |
    ✨ Follow-up Questions
    • ⤷ What are the compatible push-pin sizes for this specific heat sink model?
    • ⤷ How does 'LFM' airflow speed affect the thermal resistance of this part?
    • ⤷ What type of thermal interface material (TIM) is pre-applied to the C2 series?