The **ATS-15F-147-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed for cooling electronic components such as CPUs, GPUs, FPGAs, or power modules. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-15F-147-C2-R0 | | **Thermal Resistance** | 13.52°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 35mm x 35mm x 10mm | | **Fin Style** | Fine-pitch Cross-Cut | --- ### ### Key Electronic & Mechanical Features #### 1. Heat Dissipation Efficiency The "Cross-Cut" fin design allows for multi-directional airflow. This is critical in modern electronic enclosures where airflow might not be perfectly linear. It ensures that the component remains within its Safe Operating Area (SOA). #### 2. pushPIN™ Mounting System The `-R0` suffix indicates the use of the ATS **pushPIN™** attachment mechanism. This provides: * **Constant Pressure:** A precise compression spring force ensures maximum contact between the heat sink and the electronic component. * **Ease of Assembly:** Quick installation into pre-drilled holes on the PCB (Printed Circuit Board). #### 3. Material Properties * **Aluminum 6063:** High thermal conductivity while remaining lightweight to prevent mechanical stress on the PCB solder joints. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves radiative heat transfer. #### 4. Thermal Interface Material (TIM) Typically, these units come with **T766** pre-applied thermal phase-change material or tape on the base, ensuring there are no air gaps between the heat sink and the chip. --- ### ### Component Selection Guide When integrating this part into a circuit design, engineers consider the following: 1. **TDP (Thermal Design Power):** Ensure the heat sink can dissipate the Watts generated by the chip at the available CFM (Cubic Feet per Minute) of the fan. 2. **Z-Height Constraints:** At only 10mm tall, this is a low-profile solution suitable for 1U servers or slim embedded devices. 3. **Hole Pattern:** The PCB must have specific hole spacing to accommodate the pushPIN™ hardware.