ATS-15F-07-C2-R0
AI

The **ATS-15F-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs).
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### 1. Technical Specifications
Below are the key mechanical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance (Flowing)** | 17.00 °C/W (@ 100 LFM) |
| **Thermal Resistance (Static)** | 3.10 °C/W (@ 700 LFM) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.00mm |
| **Fin Style** | Fine Pitch (straight fins) |
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### 2. Electronic Component Breakdown
#### A. Attachment Mechanism: pushPIN™
This part uses a specific spring-loaded mechanism that ensures:
* **Constant Pressure:** Prevents the heat sink from shifting, which could damage the die or break the thermal interface.
* **Tool-less Installation:** Designed for quick assembly on PCBs with pre-drilled holes.
#### B. Thermal Interface Material (TIM)
The "R0" suffix typically indicates that the part comes with a **pre-applied Thermal Interface Material**. This is a layer of phase-change material or thermal grease that fills microscopic air gaps between the electronic chip and the heat sink base to maximize heat transfer.
#### C. Fin Design
The heat sink features a **Fine Pitch** pattern. In electronic cooling, this is optimized for:
* High-density surface area.
* Environments with active airflow (fans).
* Low-profile requirements (at only 12mm height).
---
### 3. Application Use Cases
This component is typically found in the following electronic environments:
1. **Telecommunications:** Cooling for FPGA and ASIC chips in routers or switches.
2. **Embedded Systems:** Industrial PCs where vertical space is limited.
3. **Power Electronics:** Managing heat for voltage regulators or high-speed processors.
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### 4. Part Number Decoder
```text
ATS - 15 - F - 07 - C2 - R0
| | | | | |
| | | | | └── Thermal Interface Material / Packaging
| | | | └─────── Color/Finish (Blue Anodized)
| | | └──────────── Height (12.00mm)
| | └───────────────── Fin Pattern (Fine)
| └────────────────────── Series Number
└──────────────────────────── Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What is the difference between this model and a cross-cut fin design?
- ⤷ How do I calculate the required hole spacing on the PCB for this heat sink?
- ⤷ What are the alternative thermal interface materials available for the ATS pushPIN series?