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  • ATS-15F-07-C2-R0

  • AI
    The **ATS-15F-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs). --- ### 1. Technical Specifications Below are the key mechanical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 17.00 °C/W (@ 100 LFM) | | **Thermal Resistance (Static)** | 3.10 °C/W (@ 700 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.00mm | | **Fin Style** | Fine Pitch (straight fins) | --- ### 2. Electronic Component Breakdown #### A. Attachment Mechanism: pushPIN™ This part uses a specific spring-loaded mechanism that ensures: * **Constant Pressure:** Prevents the heat sink from shifting, which could damage the die or break the thermal interface. * **Tool-less Installation:** Designed for quick assembly on PCBs with pre-drilled holes. #### B. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a **pre-applied Thermal Interface Material**. This is a layer of phase-change material or thermal grease that fills microscopic air gaps between the electronic chip and the heat sink base to maximize heat transfer. #### C. Fin Design The heat sink features a **Fine Pitch** pattern. In electronic cooling, this is optimized for: * High-density surface area. * Environments with active airflow (fans). * Low-profile requirements (at only 12mm height). --- ### 3. Application Use Cases This component is typically found in the following electronic environments: 1. **Telecommunications:** Cooling for FPGA and ASIC chips in routers or switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited. 3. **Power Electronics:** Managing heat for voltage regulators or high-speed processors. --- ### 4. Part Number Decoder ```text ATS - 15 - F - 07 - C2 - R0 | | | | | | | | | | | └── Thermal Interface Material / Packaging | | | | └─────── Color/Finish (Blue Anodized) | | | └──────────── Height (12.00mm) | | └───────────────── Fin Pattern (Fine) | └────────────────────── Series Number └──────────────────────────── Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between this model and a cross-cut fin design?
    • ⤷ How do I calculate the required hole spacing on the PCB for this heat sink?
    • ⤷ What are the alternative thermal interface materials available for the ATS pushPIN series?