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  • ATS-15D-85-C2-R0

  • AI
    The **ATS-15D-85-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for precise attachment to electronic components such as CPUs, GPUs, and other integrated circuits requiring thermal management. --- ### 1. Technical Specifications Below are the key physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Style** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Attachment Type** | Plastic Push Pin with Brass Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Thermal Performance The efficiency of a heat sink is measured by its thermal resistance (°C/W). Lower values indicate better cooling performance. | Air Flow (LFM) | Velocity (m/s) | Resistance (Unducted) | Resistance (Ducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 23.98 °C/W | 4.56 °C/W | | 300 | 1.5 | 8.31 °C/W | 2.59 °C/W | | 500 | 2.5 | 5.31 °C/W | 2.01 °C/W | --- ### 3. Key Features * **pushPIN™ Attachment:** Uses a flexible attachment system that provides consistent pressure for maximum heat transfer. * **Cross-Cut Fin Design:** The "85" series features a specific fin geometry optimized for airflow from multiple directions. * **Pre-Applied TIM:** Comes with high-performance T766 thermal interface material, reducing assembly time and ensuring even application. * **Lightweight:** Made from high-grade aluminum, minimizing mechanical stress on the PCB. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in selecting the right variant: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **15D**: Series/Mounting specific code. * **85**: Fin geometry/Base style. * **C2**: Material and Finish (Aluminum, Blue Anodized). * **R0**: Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN mounting system?
    • ⤷ Does this heat sink support customization for different thermal interface materials?
    • ⤷ How does ducted vs unducted airflow significantly change the cooling efficiency?