ATS-15D-85-C2-R0
AI

The **ATS-15D-85-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for precise attachment to electronic components such as CPUs, GPUs, and other integrated circuits requiring thermal management.
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### 1. Technical Specifications
Below are the key physical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Mounting Style** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm |
| **Attachment Type** | Plastic Push Pin with Brass Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Thermal Performance
The efficiency of a heat sink is measured by its thermal resistance (°C/W). Lower values indicate better cooling performance.
| Air Flow (LFM) | Velocity (m/s) | Resistance (Unducted) | Resistance (Ducted) |
| :--- | :--- | :--- | :--- |
| 100 | 0.5 | 23.98 °C/W | 4.56 °C/W |
| 300 | 1.5 | 8.31 °C/W | 2.59 °C/W |
| 500 | 2.5 | 5.31 °C/W | 2.01 °C/W |
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### 3. Key Features
* **pushPIN™ Attachment:** Uses a flexible attachment system that provides consistent pressure for maximum heat transfer.
* **Cross-Cut Fin Design:** The "85" series features a specific fin geometry optimized for airflow from multiple directions.
* **Pre-Applied TIM:** Comes with high-performance T766 thermal interface material, reducing assembly time and ensuring even application.
* **Lightweight:** Made from high-grade aluminum, minimizing mechanical stress on the PCB.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in selecting the right variant:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **15D**: Series/Mounting specific code.
* **85**: Fin geometry/Base style.
* **C2**: Material and Finish (Aluminum, Blue Anodized).
* **R0**: Revision/Packaging code.
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What are the PCB hole requirements for the pushPIN mounting system?
- ⤷ Does this heat sink support customization for different thermal interface materials?
- ⤷ How does ducted vs unducted airflow significantly change the cooling efficiency?