### ATS-15D-83-C2-R0: Product Overview and Specifications The **ATS-15D-83-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for efficient heat dissipation in electronic components, particularly Integrated Circuits (ICs) and CPUs. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance (Flowing)** | 1.62 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.99 °C/W @ 0 LFM | | **Dimensions (L x W x H)** | 30mm x 30mm x 30mm | | **Fins** | Cross-Cut (Square/Pin Fin) | --- ### 2. Component Analysis #### A. Thermal Management Design * **Fin Pattern:** The part features a **cross-cut** (square fin) pattern. This design allows for multidirectional airflow, making it ideal for systems where the airflow direction might be inconsistent or turbulent. * **Material:** Made from high-grade aluminum, which provides a balance between lightweight construction and high thermal conductivity. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** thermal phase change material or similar high-performance grease to ensure minimal air gaps between the heat source and the sink. #### B. Mechanical Attachment (pushPIN™) The "pushPIN™" system is the core mechanical feature: * **Springs:** Utilizes a compression spring to ensure even pressure across the surface of the component. * **Hole Pattern:** Designed for a specific pitch (distance between holes) on the PCB to allow for easy tool-free or low-tool installation. * **Hardware:** Includes a flexible selection of plastic or brass push-pins depending on the specific sub-variant. --- ### 3. Applications This heat sink is commonly used for: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Industrial PCs:** Compact computing units that require passive or semi-passive cooling. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs. 4. **Embedded Systems:** Microcontrollers and SoCs (System on Chips) that run at high frequencies. --- ### 4. Dimensional Drawing (Reference) ```text [ 30mm ] +-----------+ | | | | | [ 30mm ] | | | | | +-----------+ Height: 30mm (C-Dimension) ```