The **ATS-15D-101-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This specific part belongs to the **maxiFLOW™** series, designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications The following table highlights the critical physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm | | **Height** | 20mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 6.69° C/W (@ 100 LFM) | | **Flow Orientation** | Directional (maxiFLOW™) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that increases the surface area while minimizing pressure drop. This is particularly effective for components like CPUs, GPUs, or FPGAs. * **pushPIN™ Attachment:** This part utilizes a specialized mounting system that consists of a spring-loaded pin. This ensures consistent pressure across the thermal interface material (TIM) for optimal heat transfer and prevents the heat sink from shifting during vibration. * **Blue Anodized Finish:** The surface treatment is not just for aesthetics; it provides corrosion resistance and increases thermal emissivity, slightly improving radiation cooling. * **Pre-applied TIM:** It comes with **T766** thermal interface material, which simplifies the assembly process by eliminating the need for manual thermal paste application. --- ### 3. Electronic Applications This component is typically found in high-reliability industrial and networking equipment: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** Protecting power-dense components in compact enclosures. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.