The **ATS-15B-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 21.97°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### Key Electronic Components & Design #### 1. Push-Pin Attachment Mechanism The "15B" and "pushPIN" designation indicates a specific mounting system. Unlike adhesive-based heat sinks, this uses: * **Brass/Plastic Pins:** Spring-loaded pins that provide a consistent "clamping force." * **Compression Springs:** These ensure the heat sink remains in firm contact with the electronic component even during vibration or thermal expansion. #### 2. Thermal Interface Material (TIM) The part number suffix **"R0"** typically signifies the presence of a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad. * **Function:** It fills microscopic air gaps between the heat sink base and the chip surface to maximize heat transfer efficiency. #### 3. Fin Geometry (Straight Fin) The **straight fin** design is optimized for: * **Convection:** It works best in environments with directed airflow (active cooling). * **Low Profile:** At only 10mm height, it is ideal for thin electronic enclosures (1U servers or embedded systems). #### 4. Blue Anodized Finish The blue coating is not just aesthetic. Anodization provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Electrical Insulation:** Adds a thin layer of dielectric protection, preventing accidental shorts if a conductive object touches the fins. --- ### Application Usage This part is commonly used on: * **FPGAs and ASICs:** High-density chips that generate localized heat. * **Power Modules:** Converters that require steady heat dissipation to prevent thermal throttling. * **Networking Hardware:** Routers and switches with limited internal space.