The **ATS-15B-75-C3-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the "blue ice" or "maxiFLOW™" product line, designed primarily for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-15B-75-C3-R0 | | **Product Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Interface Material (TIM)** | T412 (Phase Change) | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 30.0mm | --- ### 2. Physical Design and Construction * **Heat Sink Geometry:** This part typically features a "Cross-Cut" or "Straight Fin" design. The high-profile height (30mm) allows it to dissipate significant heat in space-constrained layouts where vertical clearance is available. * **Material:** It is made of Aluminum, which provides a good balance between weight, thermal conductivity, and cost. * **The Blue Anodization:** The blue coating is not just for aesthetics; it provides a protective layer against corrosion and slightly improves radiant heat emissivity. --- ### 3. Key Electronic/Mechanical Features #### A. pushPIN™ Attachment System The "R0" at the end of the part number signifies the specific mounting hardware. The **pushPIN™** system uses a brass or plastic pin with a high-tension spring. * **Benefit:** Ensures consistent pressure on the electronic component, which optimizes heat transfer. * **Reliability:** It is more secure than simple "peel-and-stick" thermal tape, especially in high-vibration environments. #### B. Thermal Interface Material (T412) The unit comes pre-applied with **T412**. * **Function:** T412 is a high-performance thermal pad that fills microscopic air gaps between the component surface and the heat sink base. * **Advantage:** Pre-application ensures the correct amount of material is used, preventing assembly errors in manufacturing. #### C. Airflow Efficiency The "maxiFLOW™" design features a flared fin structure. This increases the surface area and encourages more efficient airflow through the fins, reducing the "pressure drop" compared to standard block heat sinks. --- ### 4. Applications This part is commonly used on: * **Network Switches/Routers:** For cooling high-speed processors. * **Embedded Systems:** Industrial PCs where fans might fail and passive/active cooling is critical. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. ---