ATS-15B-41-C2-R0
AI

## Overview: ATS-15B-41-C2-R0
The **ATS-15B-41-C2-R0** is a specific high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue" push-pin heat sink series, designed for cooling integrated circuits (ICs) and other electronic surface-mount components.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum 6063 |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 10.02°C/W (Unducted Flow) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 22.86mm |
| **Fin Pattern** | Straight Fin |
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### 2. Electronic Application & Usage
This part is categorized under **Board Level Thermal Management**. Its primary role is to dissipate heat generated by semiconductors to prevent thermal throttling or hardware failure.
* **Target Components:** High-speed CPUs, GPUs, FPGAs, and ASICs.
* **Mounting System:** The "Push-Pin" mechanism allows for secure attachment to a Printed Circuit Board (PCB) without the need for adhesive tape. This ensures high pressure for better thermal contact.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance phase-change material that fills microscopic air gaps between the heat sink and the chip.
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### 3. Key Electronic Benefits
1. **Passive Cooling:** Works by increasing the surface area of the heat-generating component, allowing air to carry away heat more efficiently.
2. **High Reliability:** Because it uses mechanical push-pins and springs, it is less likely to detach due to vibration or thermal cycling compared to adhesive-only solutions.
3. **Cross-Cut Design:** Many ATS models (including the B-41 series) feature fin geometries that allow for omnidirectional airflow, meaning it performs well regardless of which direction the system fan blows.
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### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **15B:** Series designator (High performance)
* **41:** Dimension/Fin configuration code
* **C2:** Material/Finish code (Blue Anodized)
* **R0:** Revision/Packaging status
- ⤷
What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Are there alternative mounting options if push-pins are not compatible with my PCB?