The **ATS-15B-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the *pushPIN™* series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and electronic application properties. --- ### 1. General Specifications This part is designed for high-density electronic cooling where airflow is provided by a fan or system ventilation. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Part Number** | ATS-15B-07-C2-R0 | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pegs) | --- ### 2. Physical Dimensions The dimensions are critical for determining PCB real estate and clearance for surrounding capacitors or inductors. | Dimension | Value | | :--- | :--- | | **Length/Width** | 45.00 mm x 45.00 mm | | **Height** | 12.00 mm (Low profile) | | **Fin Pitch** | COARSE-PITCH | | **Fin Pattern** | XCUT | | **Hole Spacing** | 38.00 mm | --- ### 3. Thermal Performance Thermal resistance indicates how effectively the part moves heat away from the semiconductor (CPU, GPU, or MOSFET). * **Thermal Resistance (Unducted):** 17.00 °C/W @ 100 LFM (Linear Feet per Minute) * **Thermal Resistance (Ducted):** 2.46 °C/W @ 200 LFM * **Heat Transfer:** Designed for optimal performance in both natural convection and forced air environments. --- ### 4. Key Electronic Features * **XCUT Fin Design:** The "XCUT" geometry allows for multi-directional airflow, making it ideal for electronic enclosures where the airflow direction might be inconsistent or obstructed. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied thermal phase-change material, ensuring a low-resistance thermal path between the chip and the aluminum. * **Attachment Hardware:** It utilizes a brass or plastic push-pin with a stainless steel spring. This provides a precise "compression force" (calculated at the factory) to prevent damaging delicate silicon dies while maintaining high contact pressure. --- ### 5. Application Example ```yaml Application: Power Supply Units (PSUs), Small Form Factor PCs, or Network Switches. Component Target: BGA (Ball Grid Array) chips or high-power MOSFETs. Purpose: To keep the junction temperature (Tj) below the manufacturer's threshold (typically 100°C - 125°C). ``` ---