The **ATS-14F-75-C3-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 1.57°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Fin Type** | Fine Pitch (Cross-cut) | --- ## 2. Key Component Features ### A. pushPIN™ Attachment Unlike adhesive tapes or simple clips, this model uses a **pushPIN™ system**. - It consists of a brass or plastic pin and a high-performance compression spring. - This ensures constant pressure (clamping force) on the component, which optimizes thermal transfer between the heat source and the sink. ### B. Material & Finish - **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. - **Blue Anodized:** The surface treatment is not just for aesthetics; anodizing increases surface emissivity and provides a layer of electrical insulation and corrosion resistance. ### C. Fin Geometry The "75" in the part number indicates a specific fin design within the ATS catalog. This model typically features a **high-density cross-cut pattern**, which allows for airflow from multiple directions, making it ideal for systems with complex internal air currents. --- ## 3. Application Use Cases This specific heat sink is categorized as a "Small Form Factor" cooling solution. 1. **Embedded Systems:** Industrial PCs where space is limited but vertical clearance allows for a 30mm height. 2. **Networking Hardware:** Cooling ASICs in routers or switches. 3. **Power Electronics:** Dissipating heat from MOSFETs or Voltage Regulators (VRMs). --- ## 4. Thermal Performance Context The **1.57°C/W** thermal resistance rating means that for every 1 Watt of power the chip generates, the temperature of the chip will rise by 1.57°C above the ambient air temperature (assuming a standard airflow of 100 Linear Feet per Minute).