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  • ATS-14F-75-C1-R0

  • AI
    The **ATS-14F-75-C1-R0** is a high-performance thermal management component specifically designed for cooling electronic integrated circuits (ICs). It belongs to the **pushPIN™** series manufactured by **Advanced Thermal Solutions (ATS)**. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (Length/Width)** | 25.00 mm x 25.00 mm | | **Height** | 30.00 mm | | **Pitch** | Fine Pitch | | **Thermal Resistance (Unducted)** | 14.95 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.62 °C/W @ 100 LFM | --- ## 2. Component Design & Features ### A. Fin Geometry (Cross-Cut) The "F" in the part number indicates a **Fine-Pitch** fin design. This increases the surface area available for heat dissipation, making it highly effective in environments with forced airflow (fans). ### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a standardized **pushPIN™** mechanism: * **Compression Springs:** Ensure consistent pressure across the interface for maximum heat transfer. * **Plastic/Brass Pins:** Secure the heatsink through pre-drilled holes in the PCB. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied thermal material. This is a high-conductivity phase-change material or grease that fills microscopic air gaps between the component (CPU/GPU) and the aluminum base. --- ## 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **14** | Series/Attachment Type | | **F** | Fin Pattern (Fine) | | **75** | Specific Footprint/Size Code | | **C1** | Thermal Performance/Material Grade | | **R0** | RoHS Compliant Version | --- ## 4. Typical Applications * **Networking Devices:** Routers, switches, and small-form-factor servers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and power transistors requiring vertical cooling clearance.
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole diameter requirements for the pushPIN system?
    • ⤷ How does the thermal resistance change at higher airflows like 500 LFM?
    • ⤷ Can this heatsink be used with a custom Thermal Interface Material (TIM)?