ATS-14F-75-C1-R0
AI

The **ATS-14F-75-C1-R0** is a high-performance thermal management component specifically designed for cooling electronic integrated circuits (ICs). It belongs to the **pushPIN™** series manufactured by **Advanced Thermal Solutions (ATS)**.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimension (Length/Width)** | 25.00 mm x 25.00 mm |
| **Height** | 30.00 mm |
| **Pitch** | Fine Pitch |
| **Thermal Resistance (Unducted)** | 14.95 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 3.62 °C/W @ 100 LFM |
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## 2. Component Design & Features
### A. Fin Geometry (Cross-Cut)
The "F" in the part number indicates a **Fine-Pitch** fin design. This increases the surface area available for heat dissipation, making it highly effective in environments with forced airflow (fans).
### B. pushPIN™ Attachment System
Instead of using messy thermal adhesives or fragile clips, this part uses a standardized **pushPIN™** mechanism:
* **Compression Springs:** Ensure consistent pressure across the interface for maximum heat transfer.
* **Plastic/Brass Pins:** Secure the heatsink through pre-drilled holes in the PCB.
### C. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied thermal material. This is a high-conductivity phase-change material or grease that fills microscopic air gaps between the component (CPU/GPU) and the aluminum base.
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## 3. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **14** | Series/Attachment Type |
| **F** | Fin Pattern (Fine) |
| **75** | Specific Footprint/Size Code |
| **C1** | Thermal Performance/Material Grade |
| **R0** | RoHS Compliant Version |
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## 4. Typical Applications
* **Networking Devices:** Routers, switches, and small-form-factor servers.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Electronics:** Voltage regulators and power transistors requiring vertical cooling clearance.
- ⤷
What are the specific PCB hole diameter requirements for the pushPIN system?
- ⤷ How does the thermal resistance change at higher airflows like 500 LFM?
- ⤷ Can this heatsink be used with a custom Thermal Interface Material (TIM)?