### Technical Overview: ATS-14F-71-C2-R0 The **ATS-14F-71-C2-R0** is a high-performance **heat sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **maxiFLOW™** series, designed specifically for high-velocity air cooling environments in electronic systems. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Part Number** | ATS-14F-71-C2-R0 | | **Type** | Heat Sink (Passive Cooling) | | **Attachment Method** | pushPIN™ | | **Fin Style** | maxiFLOW (Tapered) | | **Material** | Aluminum (Blue Anodized Finish) | | **Thermal Resistance** | 6.72°C/W @ 100 LFM | --- ### 2. Physical Dimensions Precision sizing is critical for PCB layout and clearance. * **Width:** 45.00 mm * **Length:** 45.00 mm * **Height:** 20.00 mm * **Pitch (Fin spacing):** Fine-pitch for optimized surface area. --- ### 3. Core Component Features #### A. The pushPIN™ Attachment System Unlike adhesive tapes that can fail under high heat, this part uses the **pushPIN™** mechanism. * **Spring-loaded:** Ensures consistent pressure (TIM - Thermal Interface Material compression). * **Reliability:** Resistant to shock and vibration. * **Pre-assembled:** Comes with the spring and pin already installed for rapid assembly. #### B. maxiFLOW™ Fin Design The fins are not standard rectangular blocks. They feature a **tapered design** that: * Reduces pressure drop across the sink. * Increases the surface area exposed to the airflow. * Directs air toward the center of the component where heat is highest. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of TIM applied: * **Material:** T766 (High-performance thermal grease). * **Application:** Pre-applied to the base, ensuring a low-resistance path between the electronic component (CPU, GPU, FPGA) and the aluminum body. --- ### 4. Applications This specific heat sink is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Telecommunications:** 5G infrastructure components. * **Embedded Systems:** Industrial PCs and high-performance controllers.