## Technical Overview of ATS-14F-52-C2-R0 The **ATS-14F-52-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICEAGE" line, designed for cooling integrated circuits (ICs) and other surface-mount components. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Part Number** | ATS-14F-52-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 1.07° C/W (@ 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | --- ### 2. Component Breakdown #### A. The Fin Design (Cross-Cut) This specific model utilizes a **Cross-Cut** fin pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is critical in cramped electronic enclosures where the direction of the cooling fan's exhaust may not be perfectly aligned with the heat sink. #### B. The pushPIN™ Attachment System The "14F" in the part number indicates a specific hardware configuration. The pushPIN™ system includes: * **Compression Springs:** Provides precise pressure to ensure optimal thermal interface material (TIM) contact. * **Brass/Plastic Pins:** Used to lock the heat sink into pre-drilled holes on the PCB. #### C. Thermal Performance The **C2** designation in the part number refers to the thermal performance level and the specific **Thermal Interface Material (TIM)** provided. It typically comes with a pre-applied **T766** phase-change material or a high-performance thermal pad, ensuring low thermal resistance between the component and the heat sink. --- ### 3. Dimensional Data | Dimension | Value (mm) | | :--- | :--- | | **Width (A)** | 30.00 mm | | **Length (B)** | 30.00 mm | | **Height (C)** | 25.00 mm | | **Pitch (E)** | 35.00 mm (Hole spacing) | | **Pitch (F)** | 35.00 mm (Hole spacing) | --- ### 4. Common Applications * **BGA Cooling:** Used for Ball Grid Array processors. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Telecommunications:** Cooling chips in routers, switches, and base stations. * **Embedded Systems:** Industrial PCs where vertical clearance allows for a 25mm height.