The **ATS-14F-47-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is not an active electronic chip (like a processor), but a passive thermal management component known as a **Heat Sink**. --- ## 1. Component Identification This part belongs to the **pushPIN™** Heat Sink Assembly series, designed for high-performance cooling of electronic components like CPUs, GPUs, or FPGAs. ### Technical Specifications | Parameter | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | ~9.30°C/W (at 100 LFM) | --- ## 2. Physical Dimensions The part is characterized by its compact size and specific geometry to maximize surface area for heat dissipation. | Dimension | Value (mm) | | :--- | :--- | | **Length** | 25.00 mm | | **Width** | 25.00 mm | | **Height** | 25.00 mm | | **Hole Spacing** | 30.00 mm | --- ## 3. Detailed Part Number Breakdown The part number follows a specific nomenclature that describes its physical properties: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **14**: Heat sink series (Straight Fin). * **F**: Fine pitch (Fin density). * **47**: Size/Design code. * **C2**: Thermal Interface Material (TIM). In this case, it usually refers to **T766** (a high-performance thermal grease). * **R0**: RoHS compliance status (Lead-free). --- ## 4. Key Features & Applications ### Features * **Efficient Airflow:** The straight-fin design allows for multi-directional airflow, making it versatile for different fan orientations. * **Push-Pin Mounting:** Uses a spring-loaded push-pin mechanism that provides the necessary pressure for optimal thermal contact without requiring screws. * **Pre-applied TIM:** Comes with a pre-applied thermal interface material to simplify the assembly process. ### Applications * **Embedded Systems:** Cooling microcontrollers or small processors. * **Telecommunications:** Used in routers and switches. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. ---