The **ATS-14F-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | |:---|:---| | **Part Number** | ATS-14F-34-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 47.60mm x 38.00mm x 22.90mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 6.73°C/W (at 200 LFM) | | **Fins** | High-density vertical fins | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Key Design Elements #### A. Thermal Interface Material (TIM) This specific model comes pre-applied with **T766 phase-change material**. * **Purpose:** Fills microscopic air gaps between the component surface and the heat sink base to maximize heat transfer. * **Efficiency:** It outperforms standard thermal pads in high-power applications. #### B. pushPIN™ Attachment Unlike adhesive-based heat sinks, the "R0" series uses a mechanical attachment system. * **Hardware:** Includes a brass or plastic pin and a compression spring. * **Benefit:** Provides consistent pressure (force) across the component for better thermal contact and allows for easy removal/rework without damaging the PCB. #### C. maxiFLOW™ Geometry The "F" in the part number indicates a specific fin profile. * **Design:** Features a tapered fin design that maximizes surface area while reducing pressure drop. * **Airflow:** It is optimized for forced-air cooling environments (where fans are present). --- ### 3. Application Use Cases The ATS-14F-34-C2-R0 is typically used in industrial and high-reliability electronics: * **Networking:** Switches and routers where high-speed chips generate significant heat. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs or power conversion modules. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **14:** Series/Family. * **F:** Fin profile (maxiFLOW). * **34:** Specific footprint/size code. * **C2:** Material/Finish (Blue Anodized Aluminum). * **R0:** Revision/Packaging code (includes specific TIM and pushPIN hardware).