ATS-14F-22-C2-R0
AI

The **ATS-14F-22-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **blueICE™** series, designed for cooling high-power electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics. Here is a breakdown of its core specifications:
| Feature | Specification |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Brass pins with springs) |
| **Thermal Resistance** | 13.87 °C/W (at 100 LFM) |
| **Flow Orientation** | Square (Multi-directional) |
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### 2. Physical Dimensions
Precise measurements are critical for PCB layout and clearance planning:
| Dimension | Value (mm) |
| :--- | :--- |
| **Length/Width** | 54.00 mm x 54.00 mm |
| **Height** | 12.70 mm |
| **Pitch (Mounting)** | 47.00 mm |
| **Pin Style** | Fine Pitch (High Density) |
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### 3. Key Electronic Functions
While the heat sink itself is passive, its design serves specific electronic reliability functions:
* **Thermal Dissipation:** It increases the surface area of a heat-generating component (e.g., a Power Management IC) to prevent thermal throttling or component failure.
* **pushPIN™ Attachment:** The "C2" in the part number refers to the mounting kit. This uses a spring-loaded mechanism that provides precise pressure for optimal thermal interface material (TIM) contact while preventing mechanical stress on the PCB.
* **Airflow Efficiency:** The "Fine Pitch" fin design is optimized for environments with high-velocity airflow, maximizing the convection cooling effect.
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### 4. Part Number Nomenclature Breakdown
The code **ATS-14F-22-C2-R0** can be decoded as follows:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **14:** Series identifier.
* **F:** Fin pitch style (Fine).
* **22:** Dimensions/Design code.
* **C2:** Thermal Interface Material (TIM) and Attachment kit (T766/pushPIN).
* **R0:** Revision/RoHS compliance status.
- ⤷
What is the thermal resistance of this heat sink at high airflow speeds?
- ⤷ Which mounting hole size is required for the pushPIN attachment?
- ⤷ Can this heat sink be used with a custom thermal paste?