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  • ATS-14F-22-C2-R0

  • AI
    The **ATS-14F-22-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **blueICE™** series, designed for cooling high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is a breakdown of its core specifications: | Feature | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass pins with springs) | | **Thermal Resistance** | 13.87 °C/W (at 100 LFM) | | **Flow Orientation** | Square (Multi-directional) | --- ### 2. Physical Dimensions Precise measurements are critical for PCB layout and clearance planning: | Dimension | Value (mm) | | :--- | :--- | | **Length/Width** | 54.00 mm x 54.00 mm | | **Height** | 12.70 mm | | **Pitch (Mounting)** | 47.00 mm | | **Pin Style** | Fine Pitch (High Density) | --- ### 3. Key Electronic Functions While the heat sink itself is passive, its design serves specific electronic reliability functions: * **Thermal Dissipation:** It increases the surface area of a heat-generating component (e.g., a Power Management IC) to prevent thermal throttling or component failure. * **pushPIN™ Attachment:** The "C2" in the part number refers to the mounting kit. This uses a spring-loaded mechanism that provides precise pressure for optimal thermal interface material (TIM) contact while preventing mechanical stress on the PCB. * **Airflow Efficiency:** The "Fine Pitch" fin design is optimized for environments with high-velocity airflow, maximizing the convection cooling effect. --- ### 4. Part Number Nomenclature Breakdown The code **ATS-14F-22-C2-R0** can be decoded as follows: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **14:** Series identifier. * **F:** Fin pitch style (Fine). * **22:** Dimensions/Design code. * **C2:** Thermal Interface Material (TIM) and Attachment kit (T766/pushPIN). * **R0:** Revision/RoHS compliance status.
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at high airflow speeds?
    • ⤷ Which mounting hole size is required for the pushPIN attachment?
    • ⤷ Can this heat sink be used with a custom thermal paste?