The **ATS-14F-152-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent overheating. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 3.32°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Fin Pattern** | Cross-Cut (Pin Fin) | --- ### 2. Key Components & Features #### A. Pin Fin Design Unlike traditional straight-fin heat sinks, the "Cross-Cut" or Pin Fin design allows for omnidirectional airflow. This means the heat sink can be cooled effectively regardless of which direction the air is blowing across the PCB. #### B. pushPIN™ Attachment System The **-R0** designation typically refers to the attachment kit. This system uses a flexible spring-loaded mechanism: * **Compression Spring:** Ensures precise pressure is applied to the component for maximum heat transfer. * **Push-Pins:** These snap into pre-drilled holes on the PCB (usually 3.0mm holes). #### C. Thermal Interface Material (TIM) This specific model usually comes with **T766** pre-applied thermal phase-change material or a similar thermal pad. This fills the microscopic air gaps between the heat sink base and the electronic chip to improve conductivity. --- ### 3. Application Use Cases This part is commonly found in: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but heat density is high. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on air velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.32 | | 300 (1.5 m/s) | 1.90 | | 500 (2.5 m/s) | 1.51 |