The **ATS-14F-129-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "push pin" series, designed for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-14F-129-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Dimensions** | 54.00mm x 54.00mm x 10.00mm | | **Fin Style** | XCUT (Cross-Cut) | | **Thermal Resistance** | 8.68°C/W (at 100 LFM) | --- ### 2. Key Components and Design #### A. The Heat Sink Body * **Material:** Made from high-grade aluminum for excellent thermal conductivity and lightweight properties. * **Fin Design (XCUT):** The fins are "cross-cut," creating a grid-like pattern. This design allows for multidirectional airflow, making it highly effective in systems where the direction of the cooling air may change or be unpredictable. * **Height:** At only 10mm, this is a **low-profile** heat sink, ideal for 1U servers or slim electronic enclosures. #### B. The Attachment Mechanism (Push Pins) * **Material:** Brass pins with stainless steel springs. * **Function:** The push pins go through pre-drilled holes in the PCB. The springs provide a consistent, precise amount of pressure (load) on the electronic chip, ensuring optimal contact with the thermal interface material (TIM). #### C. Thermal Interface Material (TIM) * **Pre-applied:** This specific model usually comes with **T766** phase-change material or a similar thermal pad pre-applied to the base. This eliminates the need for manual application of thermal paste and ensures air gaps are filled between the chip and the heat sink. --- ### 3. Thermal Performance Metrics The effectiveness of the ATS-14F-129-C2-R0 is measured by its thermal resistance at different airflow speeds (Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Natural)** | 8.68 | | **200 (Low Fan)** | 4.02 | | **400 (High Fan)** | 2.39 | --- ### 4. Typical Applications * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Computing:** Protecting processors on compact motherboards. * **Power Supplies:** Dissipating heat from power transistors or VRMs.