The **ATS-14D-159-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-14D-159-C1-R0 | | **Product Category** | Heat Sinks | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 2.07°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | --- ### 2. Design Characteristics The "C1" in the part number indicates the specific thermal performance and material configuration, while the "R0" typically refers to the revision or packaging style. * **Heat Sink Type:** It features a **Square** profile with a **Fine Pitch** fin design, optimized for high-airflow environments. * **pushPIN™ Attachment:** This is a specialized mounting mechanism that provides a consistent, high-pressure fit against the component, ensuring maximum heat transfer across the Thermal Interface Material (TIM). * **Blue Anodized Coating:** The blue finish is not just aesthetic; anodizing increases the surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. --- ### 3. Thermal Performance Analysis The efficiency of this heat sink is measured by its **Thermal Resistance**. Lower values indicate better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 m/s (200 LFM) | 2.07 | | 2.0 m/s (400 LFM) | 1.43 | | 3.0 m/s (600 LFM) | 1.23 | --- ### 4. Typical Applications This component is commonly found in: 1. **Networking Hardware:** Routers, switches, and gateways where CPUs generate significant heat. 2. **Industrial PCs:** Compact systems requiring passive or active cooling in tight enclosures. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.