The **ATS-13F-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other electronic surface-mount devices. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 25mm x 25mm x 20mm | | **Attachment Type** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 5.65°C/W (at 200 LFM) | | **Pressure Drop** | 0.23 inH2O (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Component Breakdown #### A. The Heat Sink Body The part uses a **straight-fin** design extruded from aluminum. The blue anodized finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. Its small footprint (25mm) makes it ideal for dense PCB layouts. #### B. Push Pin Attachment Mechanism Unlike adhesive-based heat sinks, the "75" series uses a mechanical **Push Pin and Spring** system: * **Reliability:** Provides constant pressure to ensure consistent contact with the chip. * **Ease of Installation:** Uses pre-drilled holes in the PCB. * **Material:** The pins are typically brass or plastic, paired with stainless steel springs to maintain tension over the device's lifespan. #### C. Thermal Interface Material (TIM) The **"R0"** suffix usually indicates that the heat sink comes pre-applied with a high-performance **Phase Change Material (PCM)** or a thermal pad. This ensures that air gaps between the chip and the aluminum are eliminated for maximum heat transfer. --- ### 3. Typical Applications This specific size and thermal resistance profile are commonly found in: * **Networking Gear:** Cooling small processors in routers and switches. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling voltage regulators or high-speed transistors. --- ### 4. Part Number Decoder (Example) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **13:** Series/Attachment Type * **F:** Fin Grid/Orientation * **75:** Specific Geometry/Height Identifier * **C3:** Color/Finish (Blue Anodized) * **R0:** Thermal Interface Material included