The **ATS-13F-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal characteristics of the product. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ (Plastic Pins / Springs) | | **Fin Type** | Fine-Pitch (Cross-Cut) | | **Thermal Resistance** | ~14.95°C/W (Unducted Flow) | | **Dimensions (L x W x H)** | 25mm x 25mm x 20mm | | **Finish** | Blue Anodized | --- ### 2. Design and Construction * **Fin Style:** This model features a **cross-cut** fin design. This allows for multi-directional airflow, making it highly efficient in systems where the direction of the cooling air may fluctuate or is not strictly linear. * **Base Material:** Made from lightweight aluminum, which offers a high thermal conductivity-to-weight ratio. * **Interface Material:** Usually comes with pre-applied **Phase Change Material (PCM)** or Thermal Interface Material (TIM) on the base to ensure maximum heat transfer from the chip to the sink. --- ### 3. Mounting Mechanism (pushPIN™) The "F" and "75" segments of the part number often refer to the specific attachment hardware: 1. **Springs:** Provides a precise amount of pressure (compression) to ensure the heat sink remains in contact with the component without damaging the PCB. 2. **Push Pins:** Plastic or brass pins that snap into pre-drilled holes in the PCB, allowing for quick and secure installation. --- ### 4. Thermal Performance The efficiency of the ATS-13F-75-C1-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM). * **Low Airflow:** At 200 LFM, the thermal resistance is roughly **5.11°C/W**. * **High Airflow:** At 600 LFM, the thermal resistance drops significantly to approximately **3.40°C/W**. --- ### Summary of Benefits * **Reliability:** The mechanical attachment is more secure than simple adhesive tapes. * **Efficiency:** The blue anodized finish increases emissivity and protects against corrosion. * **Scalability:** Ideal for high-density PCB layouts due to its compact 25mm footprint. ---