The **ATS-13F-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" line designed for efficient cooling of semiconductor devices. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Product Type** | Heat Sink (BGA/Chipset) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 6.67°C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ## Key Components and Design Features ### 1. Attachment Mechanism (pushPIN™) This part utilizes a specific attachment system consisting of: * **Brass Pins:** To secure the heat sink to the PCB. * **Stainless Steel Springs:** Provide a precise, consistent compression force to ensure optimal contact between the chip and the heat sink. ### 2. Thermal Interface Material (TIM) The model number suffix **C2** indicates that the part comes pre-applied with **T766 thermal grease**. This eliminates the need for manual application, reducing assembly time and ensuring a high-quality thermal bond. ### 3. Thermal Performance The efficiency of this heat sink varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.67 | | 300 (1.5 m/s) | 2.22 | | 500 (2.5 m/s) | 1.55 | --- ## Common Applications These heat sinks are typically used in environments where space is constrained but high thermal dissipation is required, such as: * **Networking Hardware:** Switches, routers, and gateways. * **Industrial PCs:** High-load CPUs and GPUs. * **Power Supplies:** Cooling voltage regulators and power MOSFETs. * **Embedded Systems:** Medical devices and automotive control units.