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The **ATS-13F-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of surface-mount components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
Below are the key physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm |
| **Fin Style** | Fine Pitch (Cross-Cut) |
| **Thermal Resistance** | 5.43 °C/W (Unducted Flow @ 100 LFM) |
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### 2. Component Design Breakdown
#### A. Fin Geometry
The "Fine Pitch" cross-cut pattern increases the surface area available for heat dissipation. This design is optimized for environments with high-velocity airflow, allowing air to pass through multiple directions.
#### B. Attachment Mechanism (pushPIN™)
Instead of adhesive tapes, this part uses a mechanical fastening system:
* **Push Pins:** Provide a secure, vibration-resistant connection to the PCB.
* **Compression Springs:** Ensure consistent "Pressure-to-Surface" contact, which is critical for minimizing thermal interface resistance.
#### C. Thermal Interface Material (TIM)
The part typically comes with a pre-applied high-performance thermal interface material. This fills microscopic air gaps between the heat sink base and the electronic component, significantly improving heat transfer efficiency.
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### 3. Application Use Cases
* **Networking Hardware:** Routers, switches, and high-speed modems.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Electronics:** Voltage regulators and power converters that generate localized hotspots.
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### 4. Thermal Performance Data
*Measured in °C/W (Lower is better)*
| Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Unducted Flow** | 5.43 | 2.62 | 2.11 | 1.84 | 1.66 |
| **Ducted Flow** | 2.45 | 1.84 | 1.58 | 1.43 | 1.32 |
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What is the difference between ducted and unducted flow for this heat sink?
- ⤷ How do I calculate the required hole pattern on my PCB for the pushPIN attachment?
- ⤷ Are there alternative finishes to 'Blue Anodized' for specific environmental requirements?