ATS-13F-35-C2-R0
AI

The **ATS-13F-35-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "maxiFLOW™" series.
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## 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal properties.
| Specification | Details |
| :--- | :--- |
| **Component Type** | Heat Sink |
| **Series** | maxiFLOW™ |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 12.48°C/W (Unducted) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 10mm |
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## 2. Key Design Features
### A. maxiFLOW™ Fin Geometry
Unlike traditional square-cut fins, this heat sink uses a **flared fin** design.
* **Purpose:** Increases the surface area available for heat dissipation.
* **Benefit:** Provides higher thermal performance within a smaller footprint, specifically optimized for forced-air environments.
### B. pushPIN™ Attachment System
The "R0" at the end of the part number indicates the mounting hardware.
* **Mechanism:** It uses a flexible, spring-loaded push-pin mechanism.
* **Reliability:** Ensures consistent pressure (clamping force) between the heat sink and the electronic component (CPU, GPU, or ASIC), which improves thermal transfer.
### C. Thermal Interface Material (TIM)
* The unit typically comes pre-applied with **T766 Phase Change Material** or similar high-performance grease.
* This fills the microscopic air gaps between the heat sink base and the chip surface.
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## 3. Electronic Applications
This part is generally used to cool medium-sized integrated circuits (ICs) that generate significant heat in cramped spaces. Typical applications include:
1. **Telecommunications:** Networking switches and routers.
2. **Embedded Systems:** Industrial PCs and controllers.
3. **Power Electronics:** DC-DC converters and high-speed transistors.
4. **Optical Modules:** SFP or QSFP transceivers requiring active cooling.
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## 4. Mechanical Drawing Reference
* **Length/Width:** 36.83 mm (approx. 1.45 inches)
* **Height:** 10 mm (Low profile)
* **Hole Pattern:** Designed for specific PCB pitch layouts to match the pushPIN™ spacing.
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What is the significance of the 'C2' designation in the part number?
- ⤷ How does 'Thermal Resistance' impact the cooling efficiency of this part?
- ⤷ Are there alternative mounting options if pushPIN is not supported by my PCB?