công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-13F-35-C2-R0

  • AI
    The **ATS-13F-35-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "maxiFLOW™" series. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties. | Specification | Details | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 12.48°C/W (Unducted) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 10mm | --- ## 2. Key Design Features ### A. maxiFLOW™ Fin Geometry Unlike traditional square-cut fins, this heat sink uses a **flared fin** design. * **Purpose:** Increases the surface area available for heat dissipation. * **Benefit:** Provides higher thermal performance within a smaller footprint, specifically optimized for forced-air environments. ### B. pushPIN™ Attachment System The "R0" at the end of the part number indicates the mounting hardware. * **Mechanism:** It uses a flexible, spring-loaded push-pin mechanism. * **Reliability:** Ensures consistent pressure (clamping force) between the heat sink and the electronic component (CPU, GPU, or ASIC), which improves thermal transfer. ### C. Thermal Interface Material (TIM) * The unit typically comes pre-applied with **T766 Phase Change Material** or similar high-performance grease. * This fills the microscopic air gaps between the heat sink base and the chip surface. --- ## 3. Electronic Applications This part is generally used to cool medium-sized integrated circuits (ICs) that generate significant heat in cramped spaces. Typical applications include: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** DC-DC converters and high-speed transistors. 4. **Optical Modules:** SFP or QSFP transceivers requiring active cooling. --- ## 4. Mechanical Drawing Reference * **Length/Width:** 36.83 mm (approx. 1.45 inches) * **Height:** 10 mm (Low profile) * **Hole Pattern:** Designed for specific PCB pitch layouts to match the pushPIN™ spacing.
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'C2' designation in the part number?
    • ⤷ How does 'Thermal Resistance' impact the cooling efficiency of this part?
    • ⤷ Are there alternative mounting options if pushPIN is not supported by my PCB?