The **ATS-13F-33-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface mount devices. ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions** | 54mm x 54mm x 15mm | | **Attachment Type** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~1.50°C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Components Breakdown #### A. The Heat Sink Body (Heat Dissipator) The core of the unit is an **Extruded Aluminum** block. Aluminum is chosen for its high thermal conductivity and light weight. The fins increase the total surface area, allowing heat to transfer from the electronic component to the surrounding air via convection. #### B. Push Pin & Spring Mechanism Unlike adhesive-based heat sinks, the "13F" series uses a mechanical attachment: * **Brass Push Pins:** These provide structural integrity and a secure fit into pre-drilled holes on the PCB (Printed Circuit Board). * **Compression Springs:** These ensure constant, even pressure on the chip. This is critical for minimizing the "Air Gap" between the chip and the heat sink, maximizing heat transfer. #### C. Thermal Interface Material (TIM) The **T766** material is pre-applied to the bottom surface. In electronics, the surfaces of a chip and a heat sink are never perfectly flat at a microscopic level. The TIM fills these microscopic air pockets, as air is a poor conductor of heat. #### D. Blue Anodized Coating The blue color isn't just aesthetic. The **anodization process** creates a thin oxide layer that: 1. Protects the aluminum from corrosion. 2. Provides slight electrical insulation. 3. Increases emissivity, slightly improving heat radiation. --- ### 3. Application Use Cases This part is typically used for cooling: * **Application Specific Integrated Circuits (ASICs)**. * **Field Programmable Gate Arrays (FPGAs)**. * **High-speed telecommunications equipment**. ---