The **ATS-13F-183-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-13F-183-C2-R0 | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions** | 40.00mm x 40.00mm x 20.00mm | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Resistance** | 5.37°C/W @ 100 LFM | --- ### 2. Design Components #### A. The Heat Sink Body * **XCUT Fin Pattern:** Unlike standard straight-fin heat sinks, the XCUT pattern creates a dense array of pins. This increases surface area and allows for omnidirectional airflow, meaning it cools effectively regardless of which way the air is blowing across the PCB. * **Aluminum Construction:** Offers a balance between lightweight design and high thermal conductivity. * **Blue Anodized Finish:** Provides corrosion resistance and a professional aesthetic. #### B. The Attachment Mechanism (Push-Pin) * **Brass Push-Pins:** These provide a secure, standardized method of mounting the heat sink to pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** These ensure constant, even pressure between the heat sink and the electronic component, which is critical for maximizing thermal transfer. #### C. Thermal Interface Material (TIM) * **Phase Change Material:** The "-R0" designation typically implies the inclusion of a high-performance thermal pad (specifically **Saint-Gobain C700** or similar), which melts at operating temperatures to fill microscopic air gaps between the chip and the heat sink. --- ### 3. Thermal Performance Overview Thermal resistance indicates how effectively the heat sink removes heat. Lower numbers are better. * **@ 100 LFM (Linear Feet per Minute):** 5.37 °C/W * **@ 200 LFM:** 3.90 °C/W * **@ 400 LFM:** 2.85 °C/W --- ### 4. Typical Applications * **FPGA Cooling:** Cooling field-programmable gate arrays in telecommunications. * **Embedded Systems:** Industrial PCs where space is limited but heat dissipation is critical. * **Network Hardware:** Routers and switches that require reliable passive or active cooling.